JPS6169840U - - Google Patents
Info
- Publication number
- JPS6169840U JPS6169840U JP15349684U JP15349684U JPS6169840U JP S6169840 U JPS6169840 U JP S6169840U JP 15349684 U JP15349684 U JP 15349684U JP 15349684 U JP15349684 U JP 15349684U JP S6169840 U JPS6169840 U JP S6169840U
- Authority
- JP
- Japan
- Prior art keywords
- tie bar
- lead
- showing
- enlarged view
- partially enlarged
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15349684U JPS6169840U (en]) | 1984-10-11 | 1984-10-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15349684U JPS6169840U (en]) | 1984-10-11 | 1984-10-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6169840U true JPS6169840U (en]) | 1986-05-13 |
Family
ID=30711513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15349684U Pending JPS6169840U (en]) | 1984-10-11 | 1984-10-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6169840U (en]) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4856064A (en]) * | 1971-11-12 | 1973-08-07 | ||
| JPS58127356A (ja) * | 1982-01-26 | 1983-07-29 | Nippon Texas Instr Kk | 半導体集積回路の樹脂封止法およびそのために用いるリ−ドフレ−ム |
| JPS5929443A (ja) * | 1982-08-10 | 1984-02-16 | Mitsubishi Electric Corp | 半導体装置用リ−ドフレ−ム |
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1984
- 1984-10-11 JP JP15349684U patent/JPS6169840U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4856064A (en]) * | 1971-11-12 | 1973-08-07 | ||
| JPS58127356A (ja) * | 1982-01-26 | 1983-07-29 | Nippon Texas Instr Kk | 半導体集積回路の樹脂封止法およびそのために用いるリ−ドフレ−ム |
| JPS5929443A (ja) * | 1982-08-10 | 1984-02-16 | Mitsubishi Electric Corp | 半導体装置用リ−ドフレ−ム |